Compound heat sink
US7592695B2 · kind B2 · utility
13Cited by
7References
24Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 11, 2006 |
| Grant date | Sep 22, 2009 |
| Priority date | — |
| Expiry date | May 28, 2027 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldThermal processes and apparatus
- WIPO sectorMechanical engineering
Abstract
A compound heat sink for the removal of thermal energy useful for, inter alia, electronic devices or other components. The compound heat sink includes a die cast base element; an extruded dissipation element having a thermal conductivity of at least about 150 W/m-K; and a thermal connection material positioned between and in thermal contact with each of the base element and the dissipation element, wherein the thermal connection material having an in-plane thermal conductivity greater than the thermal conductivity of the dissipation element.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.