Via heat sink material
US7592702B2 · kind B2 · utility
5Cited by
10References
13Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 31, 2006 |
| Grant date | Sep 22, 2009 |
| Priority date | — |
| Expiry date | Dec 26, 2026 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P70/50
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
The invention provides thermally conductive material so that less heat traveling from one side of a layer will reach connection material on another side of a layer. Rather, some of the heat will be conducted away by the thermally conductive material and dissipated.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.