Selective deposition of embedded transient protection for printed circuit boards
US7593203B2 · kind B2 · utility
17Cited by
32References
21Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 16, 2006 |
| Grant date | Sep 22, 2009 |
| Priority date | — |
| Expiry date | Dec 15, 2026 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/09309
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Protection for sensitive components on a printed circuit board by selectively depositing transient protection material on one or more layers of the printed circuit board is disclosed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.