Apparatus for absorbing and dissipating excess heat generated by a system
US7593230B2 · kind B2 · utility
485Cited by
30References
13Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 14, 2005 |
| Grant date | Sep 22, 2009 |
| Priority date | — |
| Expiry date | Dec 13, 2025 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldThermal processes and apparatus
- WIPO sectorMechanical engineering
Abstract
The invention relates to a heatsink. More particularly, the invention relates to a heatsink having tapered geometry that improves passive cooling efficiency. A tapered geometry between heatsink heat dissipation elements, as a function of distance along a z-axis opposing gravity, decreases resistance to rarification of passively flowing cooling gas upon heating. Thus, the tapered heatsink elements result in higher velocity of gas flow and increased cooling efficiency of the heatsink. Optionally, the heatsink is made from a thermally conductive polymer allowing the heatsink to be created in complex shapes using injection molding.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.