Method of manufacturing composite electronic component
US7594316B2 · kind B2 · utility
6Cited by
11References
4Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 27, 2007 |
| Grant date | Sep 29, 2009 |
| Priority date | — |
| Expiry date | Sep 2, 2027 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49165
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A composite electronic component includes a multilayer wiring block having a plurality of insulating layers and a wiring pattern, and a chip-type electronic component built-in multilayer block having a plurality of insulating payers and a wiring pattern and including a first chip-type electronic component. The multilayer wiring block and the chip-type electronic component built-in multilayer block are electrically interconnected and arranged on substantially the same plane.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.