Method of forming a slotted substrate with partially patterned layers
US7594328B2 · kind B2 · utility
1Cited by
14References
7Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 28, 2005 |
| Grant date | Sep 29, 2009 |
| Priority date | — |
| Expiry date | Sep 30, 2026 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49401
- WIPO fieldTextile and paper machines
- WIPO sectorMechanical engineering
Abstract
A method of forming a slotted substrate that includes patterning a thin film over a substrate so that at least a portion of the substrate within a slot region is not covered by the thin film. In addition, a slot is formed in the substrate through the slot region that extends through the substrate and the thin film, wherein a chip count in a shelf surrounding the slot is minimized when the slot is formed in the substrate through the thin film in the slot region.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.