Methods and apparatuses for sensing temperature of multi-via heater chips
US7594708B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 30, 2005 |
| Grant date | Sep 29, 2009 |
| Priority date | — |
| Expiry date | Jun 2, 2026 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB41J2/0458
- WIPO fieldTextile and paper machines
- WIPO sectorMechanical engineering
Abstract
Heater chips for use with a printing device, such as heater chips that include a first heater array, positioned substantially adjacent a first via, and a second heater array, positioned substantially adjacent a second via. The heater chip can also include a region, positioned between the first heater array and the second heater array, and a temperature sensing element operable to sense the temperature of the region, where the temperature sensing element is substantially centrally disposed with respect to the region. According to one embodiment of the invention, the temperature sensing element comprises a temperature sensing resistor.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.