Expanding thermal plasma deposition system
US7595097B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 8, 2005 |
| Grant date | Sep 29, 2009 |
| Priority date | — |
| Expiry date | Mar 28, 2027 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB05D1/62
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A system to coat a substrate includes a deposition chamber maintained at sub-atmospheric pressure, one or more arrays containing two or more expanding thermal plasma sources associated with the deposition chamber, and at least one injector containing orifices for each array. The substrate is positioned in the deposition chamber and each expanding thermal plasma source produces a plasma jet with a central axis, while the injector injects vaporized reagents into the plasma to form a coating that is deposited on the substrate. The injector orifices are located within a specified distance from the expanding thermal plasma source to obtain generally a coating with generally uniform coating properties.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.