Connection between a conductive substrate and a laminate
US7595131B2 · kind B2 · utility
1Cited by
9References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 10, 2001 |
| Grant date | Sep 29, 2009 |
| Priority date | — |
| Expiry date | Mar 31, 2024 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49114
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A connection (1) is provided between a conductive substrate, in the form of a planar aluminium terminal (2), and a laminate (3). The laminate has a first plastics layer, in the form of a polymer layer (4), that is secured to terminal (2) and a conductive aluminium layer (5) disposed outwardly from and adjacent to layer (4). The layers (4, 5) terminate at a common circular edge (6) that defines an opening (7) that overlies terminal (2). The connection (1) includes an insulator in the form of a grommet (8) that extends over edge (6) for electrically insulating layer (5) from terminal (2).
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.