Passive thermal solution for hand-held devices
US7595468B2 · kind B2 · utility
9Cited by
1References
4Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 7, 2005 |
| Grant date | Sep 29, 2009 |
| Priority date | — |
| Expiry date | Mar 3, 2027 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K7/20463
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
The present invention relates to a thermal solution for hand-held devices. In an embodiment, the present invention implements a thermal gap filler and a system enclosure for effective thermal management of high performance hand-held devices. In an embodiment, a hand-held device of the present invention increases the thermal power dissipation capability by reducing its system thermal resistance.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.