Pressure testing apparatus and method for pressure testing
US7595653B2 · kind B2 · utility
3Cited by
6References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 20, 2005 |
| Grant date | Sep 29, 2009 |
| Priority date | — |
| Expiry date | Jul 20, 2025 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB81B2201/0264
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A pressure testing apparatus for chips on a wafer has a pressure chamber, a support plate arranged between the upper and lower parts of the housing, a wafer chuck, a testing device and a positioning device. The wafer chuck, the testing device and the positioning device are supported to the support plate and arranged inside the pressure chamber. The support plate has, inside the pressure chamber, an opening providing a gas connection between the upper and lower parts of the housing.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.