Thermal management system and method for electronic assemblies
US7595988B2 · kind B2 · utility
1Cited by
7References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 6, 2007 |
| Grant date | Sep 29, 2009 |
| Priority date | — |
| Expiry date | Nov 6, 2027 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/083
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
According to an embodiment of the present invention, a thermal management system for an electronic assembly includes an electronic component coupled to a substrate, the substrate coupled to a coldplate, a spring member disposed between and engaging both an underside of the electronic component and the coldplate, and a heat transfer element disposed within a chamber formed by the spring member.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.