Micro-electromechanical devices and methods of fabricating thereof
US7596841B2 · kind B2 · utility
6Cited by
32References
24Claims
0Family size
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Key dates
| Filing date | Apr 23, 2004 |
| Grant date | Oct 6, 2009 |
| Priority date | — |
| Expiry date | Apr 23, 2024 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49153
Abstract
An electromechanical device includes a support structure formed by attaching inner surfaces of second and third substrates to a first substrate. The support structure includes at least one cavity between the second and third layers. An electromechanical active element is provided on an outer surface of at least one of the second or third layers.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.