Stacked module connector
US7596864B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 15, 2007 |
| Grant date | Oct 6, 2009 |
| Priority date | — |
| Expiry date | Mar 14, 2028 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49179
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A method for soldering a soft wire to a printed circuit board conveniently includes the following step: providing a bracket having a through hole and an enameled wire; fastening the enameled wire to the bracket with the conductive wire crossing over the through hole; providing a printed circuit board formed with conductive pads thereon and setting the printed circuit board onto the bracket with the pad aligned to the through hole so that a portion of the magnet wire crossing the through hole lies on the conductive pad; providing a soldering tool having a thermal contact portion and inserting the thermal contact portion into the through hole to solder the magnet wire to the conductive pad.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.