Injection molding method and apparatus
US7597829B2 · kind B2 · utility
1Cited by
1References
7Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 27, 2004 |
| Grant date | Oct 6, 2009 |
| Priority date | — |
| Expiry date | Mar 13, 2027 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB29C45/1701
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
An injection molding method that modifies a surface of thermoplastic resin using a supercritical fluid that contains a solute, and molds the thermoplastic resin, includes the steps of injecting the thermoplastic resin into a mold cavity in a mold, a space being formed between the mold cavity and the surface of the thermoplastic resin, introducing into the space the supercritical fluid that contains the solute, and exhausting from the space the supercritical fluid that contains the solute.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.