Method for holding semiconductor wafer
US7598120B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 2, 2008 |
| Grant date | Oct 6, 2009 |
| Priority date | — |
| Expiry date | May 2, 2028 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/67132
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Provided is a method comprising: back grinding a back side or a semiconductor wafer W having a protective tape applied on the surface thereof leaving annularly an outer peripheral part un-ground; separating the protective tape from a surface of the semiconductor wafer W having an annular projected part formed in the outer peripheral part of the back side; applying a holding tape over the surface of the semiconductor wafer W from which the protective tape having been separated and a surface of a ring frame f; removing and separating the outer peripheral part in the semiconductor wafer applied and held on the holding tape, by annularly cutting; applying a dicing tape over the back side of the semiconductor wafer having been made flat and the back side of the ring frame; and separating the holding tape from the ring frame and the semiconductor wafer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.