High heat dissipating LED having a porous material layer
US7598533B2 · kind B2 · utility
0Cited by
8References
20Claims
0Family size
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Key dates
| Filing date | May 2, 2006 |
| Grant date | Oct 6, 2009 |
| Priority date | — |
| Expiry date | May 2, 2026 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/8585
Abstract
A high power LED has at least a porous material layer, a thermal conductive layer and a chip. The thermal conductive layer is disposed on the surface of the porous material layer and the chip is disposed on the thermal conductive layer. Heat generated by the chip is conducted from the thermal conductive layer to the porous material layer, and convected outside via the porous material layer. Thereby, surface area in contact with the air is increased and high thermal conductivity and high heat convection are also achieved.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.