Layered structure with printed elements
US7599192B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 22, 2005 |
| Grant date | Oct 6, 2009 |
| Priority date | — |
| Expiry date | Jul 3, 2027 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/24926
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
The present invention incorporates electronic components into an electronic core structure that may be readily hot laminated by existing processes. The structure may include multiple desired electronic components, such as a display, battery or other power source, integrated circuits, switches, magnetic stripe emulator, antenna, smart chips or other input devices. The structure includes laminated buffer layers to bridge layers and compensate for variation in electronic component dimensions. The structure may also incorporate battery packaging as part of the core layer structure and use printed electronic circuitry as part of the electronic core layers to impart the desired characteristics. A variety of components may be incorporated in the structure.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.