Method of head stack assembly flexible circuit assembly attached to an actuator arm
US7600310B2 · kind B2 · utility
3Cited by
4References
6Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 16, 2006 |
| Grant date | Oct 13, 2009 |
| Priority date | — |
| Expiry date | Jul 25, 2026 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49025
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A method for mounting a head stack assembly (HSA) circuit assembly is disclosed. A flexible circuit substrate may be coupled to a stiffener. The stiffener may be a metal, such as aluminum, or some other stiff and durable material. The flexible circuit substrate may be made of an organic material and may have a series of electronic leads embedded in the flexible circuit substrate. The flexible substrate may be coupled to the stiffener by an adhesive or laminated onto the stiffener. The stiffener may be mounted onto the actuator arm by soldering or by laser welding.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.