Liquid applied seal for inkjet orifices
US7600853B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 17, 2005 |
| Grant date | Oct 13, 2009 |
| Priority date | — |
| Expiry date | Jul 2, 2026 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB41J2/1433
- WIPO fieldTextile and paper machines
- WIPO sectorMechanical engineering
Abstract
A liquid is applied by a bounded-region applicator such as a needle applicator over nozzle holes and over at least a continuous region close to the nozzle holes. The liquid is then cured to a solid before significant flow of the liquid into the nozzle holes. The liquid is chosen to cure to a solid which is sufficiently compliant that it deforms and leaves the nozzle holes under moderate pressure from a human hand or finger without breaking. Depending upon the material in which the nozzles are formed and the size of the nozzle holes, the liquid may be uniquely designed to incorporate resilient moieties or segments to satisfy these factors.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.