Polishing slurry composition and method of using the same
US7601273B2 · kind B2 · utility
4Cited by
7References
13Claims
0Family size
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Key dates
| Filing date | Mar 6, 2006 |
| Grant date | Oct 13, 2009 |
| Priority date | — |
| Expiry date | Mar 6, 2026 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC09K3/1463
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
A polishing slurry composition including an abrasive, a pH-adjusting agent, a water-soluble thickening agent, and a chelating agent, wherein the chelating agent includes at least one of an acetate chelating agent and a phosphate chelating agent, and a method of using the same.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.