Methods for producing a light emitting semiconductor body with a luminescence converter element

US7601550B2 · kind B2 · utility

Assignee

• OSRAM GmbH · DE

Inventors

• Georg Bogner · Lappersdorf, DE
• Gunter Waitl · Regensburg, DE
• Alexandra Debray · Regensburg, DE

Key dates

• Filing date: Mar 2, 2001
• Grant date: Oct 13, 2009
• Expiry date: Aug 2, 2021

Classification

• Technology area (CPC H): Electricity
• CPC primary: H10H20/0361

Abstract

The invention describes two methods of fabricating semiconductor components in which a luminescence conversion element is applied directly to the semiconductor body (1). In the first method, a suspension (4) containing a bonding agent and at least one luminescent material (5) is applied to the semiconductor body (1) in layers. In the next step the solvent escapes, leaving only the luminescent material (5) with the bonding agent on the semiconductor body.In the second method, the semiconductor body (1) is provided with a layer (6) of bonding agent to which the luminescent material (5) is applied directly.