Patent · US Expired

Method for producing an electronic circuit

US7601560B2 · kind B2 · utility

0Cited by

5References

5Claims

0Family size

Assignee

Robert Bosch GmbH · DE

Inventors

Wolfgang Jacob · Horb, DE
Christoph Ruf · Eningen unter Achalm, DE
Albert-Andreas Hoebel · Reutlingen, DE
Rolf Becker · Rheydt, DE

Key dates

Filing date	Nov 28, 2005
Grant date	Oct 13, 2009
Priority date	—
Expiry date	Jan 23, 2026

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/0002
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

The invention relates to a method for producing an electronic circuit. According to said method, two semiconductor chips (46) with essentially the same structure are mounted on a surface (13) pertaining to a first conductor carrier (10) and coated with strip conductors (16). Said two semiconductor chips (46) comprise a first surface (49) and a second surface (58), one semiconductor chip (46) being mounted on the conductor carrier surface (13) with the first surface (49) thereof, and the other semiconductor chip (46) being mounted on the conductor carrier surface (13) with the second surface (58) thereof. The second surface (58) of the first semiconductor chip (46) and the first surface (49) of the other semiconductor chip (46) are interconnected by a lead frame (64) with an A.C. power supply (31).

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.