Photosensitive resin composition
US7601764B2 · kind B2 · utility
3Cited by
2References
6Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 9, 2007 |
| Grant date | Oct 13, 2009 |
| Priority date | — |
| Expiry date | May 14, 2028 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08L33/068
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
The invention pertains to a photosensitive resin composition, comprising: and 5-95 wt % of an ethylenically unsaturated monomer containing at least one carboxy group.The inventive photosensitive resin composition possesses good heat resistance, development properties, and adhesion properties and can be used in liquid crystal displays as a photosensitive material for the manufacture of color filters.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.