Lead pin, circuit, semiconductor device, and method of forming lead pin
US7602059B2 · kind B2 · utility
35Cited by
4References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 13, 2006 |
| Grant date | Oct 13, 2009 |
| Priority date | — |
| Expiry date | Jul 13, 2026 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10689
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A lead pin of a circuit includes a pin, an insulator that surrounds the pin, and a conductor that surrounds the insulator, the conductor including non-uniformity.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.