Multilevel IC floorplanner
US7603640B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 18, 2006 |
| Grant date | Oct 13, 2009 |
| Priority date | — |
| Expiry date | Jan 26, 2028 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06F30/392
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
To generate a floorplan for an integrated circuit to be formed by a collection of modules interconnected by nets, the floorspace to be occupied by the integrated circuit is partitioned into regions and all of the modules are allocated among those regions. The regions are then iteratively partitioning into smaller progressively smaller regions with modules previously allocated any partitioned region allocated among the regions into which it was partitioned, until each region of the floorplan has been allocated no more than a predetermined maximum number of modules. A separate floorplan is then generated for each region. Neighboring regions are then iteratively merged to create progressively larger regions, until only a single region remains, wherein upon merging any neighboring regions to form a larger merged region, the floorplans of the neighboring regions are merged and refined to create a floorplan for the merged region.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.