Method of manufacturing a combined multilayer circuit board having embedded chips
US7603771B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Aug 29, 2006 |
| Grant date | Oct 20, 2009 |
| Priority date | — |
| Expiry date | Jul 14, 2027 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49165
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method of providing at least two multilayer circuit boards, combining the at least two multilayer circuit boards to form a combined multilayer circuit board, and forming multiple outer conductive vias, circuits and contacts on the combined multilayer circuit board. Each multilayer circuit board is fabricated by the steps of preparing a single-layer printed circuit board having multiple chip sections, attaching at least one chip to the corresponding chip section, attaching a frame having multiple enclosures to the single-layer printed circuit board, attaching a semi-fluid glue sheet to the frame, vacuum pressing a conductive layer on the semi-fluid glue sheet and forming multiple conductive inner vias through the multilayer circuit board. The at least two multilayer circuit boards are combined by steps of reversing one of the multilayer circuit boards and vacuum pressing other multilayer circuit boards on the reversed multilayer circuit board.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.