Assembly for extracting heat from a housing for electronic equipment
US7604535B2 · kind B2 · utility
101Cited by
22References
21Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 27, 2006 |
| Grant date | Oct 20, 2009 |
| Priority date | — |
| Expiry date | Apr 28, 2027 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K7/20745
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An assembly for extracting heat from a housing for electronic equipment, the housing having a front, a back, two sides and a top. The assembly is defined by a back for the housing that defines an open area proximate the top, and an air passageway in fluid communication with the open area in the back, to conduct heated air exiting the housing through the open area away from the housing.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.