Resistor compositions for electronic circuitry applications
US7604754B2 · kind B2 · utility
4Cited by
8References
3Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Nov 19, 2007 |
| Grant date | Oct 20, 2009 |
| Priority date | — |
| Expiry date | Jan 18, 2028 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/0154
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
Resistor compositions are disclosed, made from polymer thick film resistor formulations comprising a polyimide component, a sterically hindered hydrophobic epoxy component and a solvent component having a Hanson polar solubility parameter between 2.1 and 3.0 and having a normal boiling point between 210 and 260° C. The weight ratio of polyimide component (“A”) to epoxy component (“B”) is A:B, where A is between and including 1 to 15 and where B is 1.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.