Method of bonding a polymer surface to a conducting or semiconducting surface and application of the same
US7605050B2 · kind B2 · utility
5Cited by
8References
20Claims
0Family size
Assignees
Inventors
Key dates
| Filing date | Aug 25, 2003 |
| Grant date | Oct 20, 2009 |
| Priority date | — |
| Expiry date | Jul 15, 2024 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08J5/122
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
The invention relates to a method of bonding a polymer surface to an electrically conductive or semiconductive surface, which method is characterized in that it comprises: It also relates to applications of this method and to structures obtained by its implementation.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.