Curing composition
US7605220B2 · kind B2 · utility
9Cited by
48References
16Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 23, 2004 |
| Grant date | Oct 20, 2009 |
| Priority date | — |
| Expiry date | Oct 5, 2024 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08L43/04
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
An object of the present invention is to provide a curing composition which is practically curable and highly adhesive even though a non-organotin compound is included as a curing catalyst. Problems involved are solved by a curing composition characterized by including (A) an organic polymer having one or more silicon-containing groups capable of cross linking by forming siloxane bonds, (B) a metal carboxylate and/or carboxylic acid, and (C) a silicon compound having a hetero atom on the carbon atom in the α or β position with respect to the silicon atom.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.