Patent · US Active

Laser processing head

US7605342B2 · kind B2 · utility

4Cited by

23References

18Claims

0Family size

Assignee

TRUMPF Werkzeugmaschinen GmbH + Co. KG · DE

Inventors

Martin Lambert · Buckingham, GB
Jürgen-Michael Welck · Asperg, DE

Key dates

Filing date	Aug 5, 2005
Grant date	Oct 20, 2009
Priority date	—
Expiry date	Sep 18, 2027

Classification

Technology area (CPC B)Performing Operations; Transporting
CPC primaryB23K26/128
WIPO fieldMachine tools
WIPO sectorMechanical engineering

Abstract

A laser processing head includes a first housing region associated with a beam guidance of a laser processing machine, a second housing region associated with the laser processing head, and an aperture in a wall separating the first and second housing regions. The head is configured such that a laser beam may pass sequentially through the beam guidance, the first housing region, the aperture, and the second housing, and the first housing region includes a first gas atmosphere associated with the beam guidance and maintained at a higher pressure than a second gas atmosphere in the second housing region.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.