Structure of chip carrier for semiconductor optical device, optical module, and optical transmitter and receiver
US7605402B2 · kind B2 · utility
0Cited by
4References
15Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 18, 2005 |
| Grant date | Oct 20, 2009 |
| Priority date | — |
| Expiry date | Mar 28, 2026 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01S5/06226
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A chip carrier includes a metal-coated portion formed on a front surface of a substrate and to be mounted a device, and a rear surface of the substrate being coated with a metal, in which a metal-coated portion is formed on a side surface of the substrate and the metal-coated portion on the front surface of substrate is connected with the metal-coated portion on the rear surface by the metal-coated portion formed on the side surface of the substrate, thereby maintaining frequency characteristics of the optical semiconductor device.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.