Thermally enhanced memory module
US7606034B2 · kind B2 · utility
1Cited by
15References
12Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 4, 2007 |
| Grant date | Oct 20, 2009 |
| Priority date | — |
| Expiry date | Jun 4, 2027 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10734
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A thermally enhanced memory module is claimed. The memory module includes a first extended electrical plane, and a thermal connection between a surface plane of its substrate and the first extended electrical plane. A first thermal management, such as a heat spreader, is coupled to the surface plane of the substrate and to the thermal connection.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.