Miniaturized imaging module construction technique
US7606410B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 26, 2009 |
| Grant date | Oct 20, 2009 |
| Priority date | — |
| Expiry date | Jan 26, 2029 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49169
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A method of constructing an image reader module and the image reader are described. The image reader module includes two or more circuit boards in a stacked configuration. Corresponding notches for receiving supports are formed along adjacent edges of the boards, which also have electrical contact points at the edges of each board connected to circuits on the boards. The supports are mounted in the notches between the two or more circuit boards to structurally interconnect the boards. Each of the supports, which may be flex cables or conductive bus bars, have one or more electrical conductors that are electrically connected to the contact points on the boards to electrically interconnect the boards, whereby the connections between the electrical conductors and the contact points form test points for the module. The notches may be substantially rectangular to receive the flex cable or may be slots to receive a bus bar. One end of the structural support flex cable or bus bar may be flush with one of the circuit boards and the other end of the structural support may extend past another one of the circuit boards. The supports may be soldered to the edges of the boards within the notche…
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.