Method of making a device for measuring deformation
US7607213B2 · kind B2 · utility
1Cited by
4References
4Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 24, 2008 |
| Grant date | Oct 27, 2009 |
| Priority date | — |
| Expiry date | Apr 24, 2028 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49007
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A method of making a device for measuring deformation includes a step of depositing a silicon adhesion underlayer on a silicon carbide surface by chemical vapor spraying, and a step of depositing a coating on the silicon adhesion underlayer by atmospheric thermal spraying.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.