Electro-fluidic interconnect attachment
US7607223B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 7, 2007 |
| Grant date | Oct 27, 2009 |
| Priority date | — |
| Expiry date | Nov 27, 2027 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49208
- WIPO fieldMechanical elements
- WIPO sectorMechanical engineering
Abstract
An electro-fluidic interconnection. The interconnection includes a body (200) formed of a ceramic material. The body (200) is provided with an aperture (206) having a profile suitable for receiving an interconnecting conduit (400). The interconnecting conduit (400) can be formed of the same type of ceramic material as the body (200). The conduit (400) is defined by an outer shell (403) with a hollow bore (402) for transporting a fluid. A mating portion (404) of the conduit has an exterior profile that matches the profile of the aperture. Moreover, the mating portion (404) of the conduit (400) can be compression fitted within the aperture (206). Conductive traces (406, 208) on the conduit and the body can be electrically connected to complete the electro-fluidic interconnection.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.