Superabsorbent polymer root dip
US7607259B2 · kind B2 · utility
12Cited by
37References
18Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Jan 17, 2006 |
| Grant date | Oct 27, 2009 |
| Priority date | — |
| Expiry date | Oct 8, 2027 |
Classification
- Technology area (CPC A)Human Necessities
- CPC primaryA01G24/35
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
A superabsorbent polymer (“SAP”) root dip composition and methods of delivering a SAP to a plant are disclosed. A root structure of a plant may be dipped into a SAP hydrogel. The plant may then be planted, stored or transported for subsequent planting.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.