Circuit board mounting for temperature stress reduction
US7607350B2 · kind B2 · utility
6Cited by
8References
29Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Oct 6, 2005 |
| Grant date | Oct 27, 2009 |
| Priority date | — |
| Expiry date | Aug 14, 2026 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K7/1417
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A circuit board mounting system in one example comprises an improved mounting system for a circuit board disposed between housing elements, wherein the improvement comprises a plurality of slots formed in the circuit board and a plurality of bushings disposed within the slots, such that the housing elements rest on opposed ends of the bushings, and the circuit board moves in a plane substantially parallel to its mounting surfaces in response to changes in temperature, thus reducing thermal stress.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.