Conductive ink composition and method of forming a conductive pattern using the same
US7608204B2 · kind B2 · utility
4Cited by
1References
8Claims
0Family size
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Key dates
| Filing date | Jan 24, 2008 |
| Grant date | Oct 27, 2009 |
| Priority date | — |
| Expiry date | Jan 24, 2028 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K1/097
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
A conductive ink composition includes about 15% to about 50% by weight of copper nanoparticles, about 40% to about 80% by weight of a non-aqueous solvent mixture, about 0.01% to about 5% by weight of a dispersion agent and about 1% to about 20% by weight of a wetting agent. A conductive pattern may be formed with use of the conductive ink composition and an inkjet printer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.