Thermally conductive EMI shield
US7608326B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Oct 21, 2003 |
| Grant date | Oct 27, 2009 |
| Priority date | — |
| Expiry date | Sep 18, 2024 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/32
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Electromagnetic-energy absorbing materials are combined with thermally conductive materials, such as those used for thermal management in association with electronic equipment, thereby suppressing the transmission of electromagnetic interference (EMI) therethrough. Disclosed are materials and processes for combining EMI-absorbing materials with thermally conductive materials thereby improving EMI shielding effectiveness in an economically efficient manner. In one embodiment, a thermally conductive EMI absorber is prepared by combining an EMI-absorbing material (for example, ferrite particles) with a thermally conducting material (for example, ceramic particles), each suspended within an elastomeric matrix (for example, silicone). In application, a layer of thermally conductive EMI-absorbing material is applied between an electronic device or component, and a heat sink
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.