Interconnect packaging systems
US7608919B1 · kind B1 · utility
30Cited by
101References
25Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 15, 2006 |
| Grant date | Oct 27, 2009 |
| Priority date | — |
| Expiry date | Nov 15, 2026 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P70/50
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The present invention provides a quilt packaging system for microchip, a method for making such a quilt packaging system, microchips that may be used in a such a quilt packaging system, and methods for making such microchips.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.