System, device and method for reducing cross-talk in differential signal conductor pairs
US7609125B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 13, 2006 |
| Grant date | Oct 27, 2009 |
| Priority date | — |
| Expiry date | Mar 19, 2027 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/09236
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Systems, devices and methods are disclosed herein for reducing crosstalk between pairs of differential signal conductors. One or more ground traces connected to one or more over- or under-lying ground planes by vias are located between pairs of differential signal conductors. The electrical shielding provided by the combination of the one or more ground traces and the one or more ground planes results in reduced cross-talk between different pairs of differential signal conductors, and facilitates high-speed data rates between integrated circuits and printed circuit boards. In a preferred embodiment, such ground traces and ground planes are employed in HiTCE packaging containing multiple pairs of differential signal conductors.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.