Heat spreader with vapor chamber defined therein
US7609520B2 · kind B2 · utility
25Cited by
4References
15Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 23, 2007 |
| Grant date | Oct 27, 2009 |
| Priority date | — |
| Expiry date | Jun 19, 2027 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldThermal processes and apparatus
- WIPO sectorMechanical engineering
Abstract
A heat spreader includes a bottom wall (12) and a cover (14) hermetically connected to the bottom wall. Cooperatively the bottom wall and the cover define a space (11) therebetween for receiving a working fluid therein. A wick structure (15) is received in the space and thermally interconnects the bottom wall and the cover. The wick structure includes at least a carbon nanotube array, which can conduct heat from the bottom wall to the cover and draw condensed liquid of the working fluid from the cover toward the bottom wall.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.