Heat sink assembly
US7609522B2 · kind B2 · utility
13Cited by
9References
7Claims
0Family size
Assignees
Inventors
Key dates
| Filing date | Dec 1, 2006 |
| Grant date | Oct 27, 2009 |
| Priority date | — |
| Expiry date | Jul 23, 2027 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A heat sink assembly (10) compatible with an ATX motherboard (20) and a BTX motherboard (30), includes a heat sink and a plurality of fasteners (15) extending through the heat sink. The heat sink includes a base (12) defining a slot (1220) therein. The fastener is capable of sliding along the slot between a first position to a second position to make the heat sink assembly in accordance with the preferred embodiment of the present invention to be adapted for use with the ATX motherboard or the BTX motherboard.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.