Package structure for panel module and method using the same
US7609524B2 · kind B2 · utility
6Cited by
3References
5Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 19, 2006 |
| Grant date | Oct 27, 2009 |
| Priority date | — |
| Expiry date | Nov 16, 2027 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K7/1417
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A package structure for packaging a panel module. The panel module comprises at least a gap. The package structure comprises a base and a cover. The base comprises a first loading surface for loading the panel module and at least one first engaging portion corresponding to the gap. The cover comprises a first covering surface and a second engaging portion corresponding to the first engaging portion. The first engaging portion and the second engaging portion connect the first loading surface and the first covering surface.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.