Electronic module
US7609527B2 · kind B2 · utility
19Cited by
14References
27Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 17, 2007 |
| Grant date | Oct 27, 2009 |
| Priority date | — |
| Expiry date | Oct 17, 2027 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49169
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An electronic module in which an installation base is used, which includes an insulating-material layer (1) and a conductive layer on the surface of the insulating-material layer. The conductive layer also covers the installation cavity of a component (6). The component (6) is set in the installation cavity, in such a way that the contact zones face towards the conductive layer and electrical contacts are formed between the contact zones of the component (6) and the conductive layer. After this, conductive patterns (14) are formed from the conductive layer, to which the component (6) is attached.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.