Heat transfer sheet, heat transfer structural body and manufacturing method of the heat transfer structural body
US7610678B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 16, 2004 |
| Grant date | Nov 3, 2009 |
| Priority date | — |
| Expiry date | Dec 16, 2024 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/4935
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A pattern is formed with an insulative resin on a bonding face of a silicon chip, which is a heat generating element, and a pattern is formed with the insulative resin on a bonding face of a heat sink, which is a heat dissipating element, in alignment with the insulative resin parts formed on the silicon chip. The silicon chip and the heat sink are bonded to each other via a heat transfer sheet. The silicon chip and the heat sink are bonded to each other by a metal to form metal connection portions in a region where no insulative resin parts are formed, while the silicon ship and the heat sink are bonded to each other by a resin to form resin connection portions in a region where the insulative resin parts are formed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.