Method of manufacturing a dielectric component, and dielectric components manufactured by such a method
US7611617B2 · kind B2 · utility
0Cited by
7References
10Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 12, 2007 |
| Grant date | Nov 3, 2009 |
| Priority date | — |
| Expiry date | Mar 12, 2027 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01G4/005
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A method of forming a dielectric component, such as a capacitor is disclosed. In such a method, a conductive surface is applied to a dielectric to form a coated dielectric. Then a portion of the conductive surface is removed from the coated dielectric to form at least two electrically isolated conductive areas.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.