Thick film conductor compositions and the use thereof in LTCC circuits and devices
US7611645B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 5, 2006 |
| Grant date | Nov 3, 2009 |
| Priority date | — |
| Expiry date | Apr 5, 2026 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/1131
- WIPO fieldMaterials, metallurgy
- WIPO sectorChemistry
Abstract
The present invention is directed to a thick film composition for use in low temperature co-fired ceramic circuits comprising, based on weight percent total thick film composition: (a) 30-98 weight percent finely divided particles selected from noble metals, alloys of noble metals and mixtures thereof; (b) one or more selected inorganic binders and/or mixtures thereof, and dispersed in (c) organic medium, and wherein said glass compositions are immiscible or partially miscible with remnant glasses present in the low temperature co-fired ceramic substrate glasses at the firing conditions.The present invention is further directed to methods of forming multilayer circuits utilizing the above composition and the use of the composition in high frequency applications (including microwave applications).
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.